Features
1)Softness like clay
・High flexibility in shape
・Available in 3-dimensional space
2)Excellent handling and reworkability by low stickiness
・Non-fluidity
・Lower stickiness than conventional thermal grease
3)Electrical insulation characteristics
・Available for electronic parts
4)”Siloxane-reduced type” contains low-molecular siloxane
・The content of low-molecular siloxane is
less than 50ppm(measured value)
Comparison with heat conduction sheet
Evaluation method: Measure a temperature of an amplifier IC and a 3-terminal regulator, a heat generator.
Compare the temperature rise suppression effect of a heat conduction sheet (about 5 W/m K) with "Thermally Conductive Compound like Clay" (2.8 W/m K).
Test results: "Thermally Conductive Compound like Clay" has better heat conduction efficiency than a heat conduction sheet of about 5 W/m K. (Based on in-house evaluation)
Comparison of temperature rise suppression using thermally conductive materials (image)
For a catalog of "Thermally Conductive Compound like Clay", please click here.
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Notes on Handling Products
●The information and data provided are not standard or guaranteed.
●Not for resale overseas.
●Do not use on medical devices that are implanted into human or animal bodies or come into contact with body fluids or living tissues.
●Do not put this product in your mouth or swallow it as it is not food.
●A very small amount of silicone oil in the product may bleed, so use it where there is no problem.
●Dispose of the product in accordance with national and local laws and regulations.
●The contents of this webpage are subject to change without notice.